CVD Diamond Wire Drawing Dies - (111) Crystal Orientation
The Ultimate Solution for Precision Wire Manufacturing
Dimensional parameters
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Key Specifications
1.Exceptional Mechanical Properties
· Young's Modulus: 1150-1300 GPa
· Microhardness: 80-150 GPa
· Adjustable Nitrogen Content: 30-200 ppm
2.Flawless Monocrystalline Structure
· Inclusion/Dislocation Free
· Wear Rate Variation <5%
· Custom Solutions: Lattice Engineering for Hard/Soft Wires
3.Unrivaled Durability
· Fracture Strength >8 GPa (3-Point Bending Test)
· 5,000km Crack-Free Operation (φ0.03mm Cu Wire)
· 92% Lower Cracking Rate vs PCD Dies
4.Atomic-Level Precision
· (111) Orientation Accuracy <0.5° (XRD Aligned)
· Bore Tolerance: ±0.05mm
· Surface Roughness Ra <0.1μm
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Competitive Advantages of (111)-Oriented CVD Diamond
1.Crystal Orientation Engineering: (111) plane maximizes shear strength along <110> wire drawing direction, 3x more wear-resistant than PCD
2.Defect-Free Reliability: Monocrystalline structure eliminates intergranular fracture risks in polycrystalline materials
3.Intelligent Thermal Management: 2000 W/m·K thermal conductivity prevents localized overheating
4.Nano-Scale Precision: Laser-machined bore surface (Ra<0.1μm) reduces wire surface scratches by 95%
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Technical Superiority
· Smart Matching System: Auto-recommends nitrogen gradient by wire hardness
· Thermal Stability: <0.002% Deformation at 1200℃
· Modular Design: Quick-change structure minimizes downtime
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Applications
1.Ultra-Fine Refractory Wires
2.Stainless Steel Wire
3.Precious Metal Processing
4.High-Performance Alloys
5.Semiconductor Bonding Wires
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Product Pictures
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CVD Diamond Wire Drawing Dies 3x Longer Life for Tungsten / Gold Wire Production Images
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